Routing layer for mitigating stress in a semiconductor die

ABSTRACT

A routing layer for a semiconductor die is disclosed. The routing layer includes pads for attaching solder bumps; bond-pads bonded to bump-pads of a die having an integrated circuit, and traces interconnecting bond-pads to pads. The routing layer is formed on a layer of dielectric material. The routing layer includes conductive traces at least partially surrounding some pads so as to absorb stress from solder bumps attached to the pads. Parts of the traces that surround pads protect parts of the underlying dielectric material proximate the solder bumps, from the stress.

RELATED CO-PENDING APPLICATION

This application is a continuation of co-pending U.S. patent applicationSer. No. 12/604,584, filed Oct. 23, 2009, entitled “ROUTING LAYER FORMITIGATING STRESS IN A SEMICONDUCTOR DIE”, having inventors RodenTopacio et al., owned by instant assignee and is incorporated herein byreference.

FIELD OF THE INVENTION

The present invention relates generally to semiconductor dice, and moreparticularly to routing layer design for a semiconductor die.

BACKGROUND OF THE INVENTION

Modern semiconductor packages are manufactured by forming a number ofintegrated circuits on a semiconductor wafer. The wafer is typicallydiced—cut into individual pieces—each of which is called a die. Each dieincludes one or more integrated circuits on one surface. This surface(often referred to as the “active surface”) includes a number of signalinterface contacts called input-output (I/O) pads.

A die is typically packaged using a carrier substrate that includessolder balls suitable for attachment onto an external circuit board. Thecarrier substrate usually includes a core and one or more buildup layersformed on either side of the core. Each buildup layer has metallizationor traces formed on a layer of dielectric material. The carriersubstrate includes bond-pads for electrical interconnection with I/Opads of the die. Traces on the substrate are used to interconnectindividual bond-pads with their corresponding solder balls.

A variety of bonding techniques may be used to form reliable electricalconnections between I/O pads on the die and the bond-pads on thesubstrate. Two of the most popular techniques are wire-bonding and flipchip assembly.

In wire-bonding, the die is placed on the carrier substrate, with itsactive surface facing away from the carrier substrate. Wires are thenbonded to I/O pads on the die at one end, and corresponding bond-pads onthe substrate at the other end.

In flip chip assembly however, the active surface of the die faces thecarrier substrate when the die is attached. Small amounts of soldercalled solder bumps are deposited on each I/O pad prior to attachment.The solder bumps are then melted to interconnect each I/O pad on the dieto a corresponding bond-pad on the substrate.

I/O pads on a die may be placed anywhere over the active surface of thedie. For example, in some dice, I/O pads may be distributed all over theactive surface while in others the I/O pads may be restricted to nearthe peripheral boundaries of the die. In either case, I/O pads on a dieare typically not aligned with the bond-pads on a substrate, to whichthey are ultimately attached. The I/O pads may also be too close to eachother to allow proper solder bump formation, as is required during flipchip assembly. As a result, it is often advantageous to redistributethese original I/O pads to new pad locations (called bump-pads) that arebetter suited for solder bump formation. The bump-pads can then bealigned with bond-pads on a substrate and attached using solder bumps.To redistribute the original I/O pads to new bump-pad locations suitablefor flip-chip bonding, a routing layer or a redistribution layer (RDL)is typically formed over the silicon wafer, or an individual die, on theactive surface.

The routing layer is often formed on a thin dielectric layer, on whichconductive traces are formed to interconnect each I/O pad to acorresponding bump-pad. The traces are insulated from the lower layersof the die by the dielectric material, except at the I/O pads where theyinterconnect. The routing layer allows I/O drivers to be placed anywherein the die, without having to consider positions of the substratebond-pads. I/O drivers may thus be freely placed in the die, as theredistribution layer would align the solder bumps formed on itsbump-pads with bond-pads on the substrate. The use of a routing layeralso simplifies the formation of substrates, and often leads to fewerbuildup layers, which reduces cost.

The routing layer may include multiple layers of dielectric materialsand associated traces depending on routing needs. A passivation layer isoften formed over the top routing layer, to protect metal traces fromexposure to air. Openings in the passivation layer expose the bump-pads.

Under bump metallization (UBM) are typically formed on the exposed bump-pads to provide low resistance electrical connections to solder bumps,for attachment to the substrate. A solder bump is typically formed onthe UBM of the bump-pad for example by deposition of solder paste.

During flip-chip attachment, the solder bumps formed on theredistributed bump-pads are aligned with corresponding bond-pads in thesubstrate, and then reflowed or melted to form reliable electrical andmechanical contacts.

After a semiconductor die is attached to a substrate, its solder bumpsare often subjected to mechanical and thermal stress during operation.Each bump-pad helps absorb much of the stress that would otherwiseimpact the underlying dielectric layer in the routing layer. To buffersuch stress from solder bumps, each bump-pad is often made at least aslarge as (and often substantially larger than) its corresponding UBM.

However, this is disadvantageous as larger bump-pads reduce the areaavailable for routing conductive traces in the routing layer, leading toa denser arrangement of traces and bump-pads which can potentiallycompromise signal integrity. Moreover traces that must be routed aroundlarge bump-pads may need to be made longer, which increases theirresistance and capacitance. Increased resistance and capacitance ontraces, often leads to voltage drops in power traces and longerpropagation delays in signal traces. In addition, newer, smaller diceoften require much smaller bump-pads to increase the available area fortheir routing needs, and often use brittle dielectric materials.

One known method for reducing bump-pad sizes is the use of Polyimidebetween a large UBM formed atop a small bump-pad to assist in mitigatingstress that may affect dielectric layers of the die. Unfortunatelyhowever, this adds to packaging cost and may not work well with brittledielectric layers.

Accordingly, there is a need for semiconductor die that allows anincrease in the number of traces without compromising signal integrity,and protect dielectric layers against thermal and mechanical stress.

SUMMARY OF EMBODIMENTS OF THE INVENTION

In accordance with one aspect of the present invention, there isprovided a semiconductor die including: an integrated circuit formed onone surface of a piece of semiconductor wafer; a plurality ofinput-output (I/O) pads interconnected to the integrated circuit; and arouting layer. The routing layer includes: a dielectric layer formed onone surface; and a plurality of conductive traces formed on thedielectric layer, each of the conductive traces extending between one ofthe I/O pads and one of a plurality of bump-pads formed on thedielectric layer. The semiconductor die also includes a plurality ofunder-bump metallizations (UBMs), each having a top surface forattaching a respective one of a plurality of solder bumps; and a bottomcontact surface smaller than the top surface, in physical contact with arespective one of the bump-pads. At least some of the conductive tracespass proximate the bump-pads without contacting the bump-pads, beneaththe top surface of the UBMs, to mechanically reinforce the routing layerproximate the UBMs.

In accordance with another aspect of the present invention, there isprovided a semiconductor die including: at least one integrated circuitformed on one surface, and a plurality of input-output (I/O) padsconnected to the integrated circuit; a routing layer including adielectric layer formed on the surface of the die, and a plurality ofconductive traces formed on the dielectric layer, each of the conductivetraces extending between one of the I/O pads and one of a plurality ofbump-pads formed on the dielectric layer; and a plurality of solderbumps formed on the bump-pads, for electrically interconnecting theintegrated circuit to a substrate. At least one of the bump-pads iscontained within a circular circumscribing area having a radius greaterthan or equal to the mean radius of a top surface of a correspondingunder-bump metallization (UBM) formed on the each bump-pad. At leastsome of the conductive traces pass through the circular circumscribingarea without contacting a contained bump-pad, to mechanically reinforcethe routing layer proximate the contained bump- pad.

Other aspects and features of the present invention will become apparentto those of ordinary skill in the art upon review of the followingdescription of specific embodiments of the invention in conjunction withthe accompanying figures.

BRIEF DESCRIPTION OF THE DRAWINGS

In the figures which illustrate by way of example only, embodiments ofthe present invention,

FIG. 1 is a plan view of a conventional routing layer for a conventionalsemiconductor die that redistributes I/O pads to bump-pads;

FIG. 2 is a vertical cross-sectional view of a conventionalsemiconductor die;

FIG. 3 is a plan view of a portion of the conventional semiconductor dieof FIG. 2;

FIG. 4 is a vertical cross-sectional view, of a portion of asemiconductor die exemplary of an embodiment of the present invention;

FIG. 5 is a plan view of a portion of the exemplary semiconductor diedepicted in FIG. 4;

FIG. 6 is another cross-sectional view of a the exemplary semiconductordie of FIG. 4;

FIG. 7 is a diagram depicting relative sizes of the exemplary bump-padof FIG. 5 and the conventional bump-pad of FIG. 4;

FIG. 8 is a plan view of an exemplary routing layer of the semiconductordie of FIG. 4; and

FIG. 9 is the plan view of FIG. 8, with overlays of conventionalbump-pads drawn for purposes of comparison with exemplary bump-pads.

DETAILED DESCRIPTION

FIG. 1 depicts a plan view of the routing layer of a conventionalsemiconductor die 100. Die 100 includes original I/O pads 114A, 114B,114C (individually and collectively I/O pads 114) forming part of itsintegrated circuit, and redistributed bump-pads 104A, 104B, 104C, 104D(individually and collectively bump-pads 104) suitable for flip chipsolder bump formation. Conductive traces 122A, 122B, 122C, 122D, 122E,122F (individually and collectively conductive traces 122), interconnectI/O pads 114 to corresponding bump-pads 104.

FIG. 2 depicts a vertical cross-sectional view of a portion ofconventional semiconductor die 100, including conductive trace 122, I/Opad 114, and bump-pad 104 with a solder bump 112 formed thereon. I/O pad114 is formed on a lower metal layer 116 of die 100 which includes anintegrated circuit formed on a piece of semiconductor wafer (e.g.,silicon wafer).

Bump-pads 104 provide I/O connection points to the integrated circuit.Solder bumps 112 formed on bump-pads 104 are used to attach die 100 to asubstrate such as a carrier substrate or a printed wiring board, usingflip-chip attachment techniques.

A routing layer 108, formed over lower metal layer 116 includesdielectric layer 120 and conductive traces 122 formed thereon.Dielectric layer 120 insulates lower metal layer 116 from conductivetraces 122, except at the I/O pads 114. Each one of conductive trace 122interconnects an I/O pad 114 to a bump-pad 104.

Under-bump metallization (UBM) 102, formed on each of bump-pads 104,provides a low resistance attachment surface for each of solder bumps112. Each UBM 102 may have a top surface 102A in communication withsolder bump 112 and a bottom contact surface 102B in communication withbump-pad 104.

To interconnect die 100 to a substrate, solder bumps 112 are alignedwith bond-pads on the substrate and melted using heat to form electricaland mechanical bonds with the substrate.

During operation, semiconductor die 100 consumes electrical energy inthe form of a voltage or current input, and dissipates some of thatenergy as heat. Heat causes both die 100 and the substrate to which itis attached, to expand at their respective coefficients of thermalexpansion (CTE). The CTE of die 100 and the CTE of the substrate (towhich die 100 is interconnected via solder bumps 112) are oftendifferent. This mismatch in CTE values causes thermal stress on solderbumps 112 and other nearby structures such as UBM 102 and dielectricmaterial 120 in routing layer 108. In addition to thermal stress,structures proximate solder bumps 112 may also be subjected tomechanical stress resulting from flexing and/or vibration of either thesubstrate or die 100.

Thermal and/or mechanical stress could potentially damage routing layer108 (specifically, dielectric material 120) and other materials used inlower layer 116. For example, extreme low K (ELK) dielectric materials(having dielectric constant values of κ<3.0) may be used in lower layer116. However, ELK materials tend to be brittle, and may warp, crack orbreak under mechanical or thermal stress. Dielectric materials that arenot necessarily ELK may also be damaged from exposure to thermal andmechanical stress.

To mitigate the effects of stress on the dielectric material 120 ofrouting layer 108 and lower layer 116, bump-pads 104 are often madelarger than UBM 102. Large bump-pads help absorb stresses that wouldotherwise impact the underlying dielectric material.

The relative sizes of the surfaces of UBM 102 and bump-pad 104 areillustrated in FIG. 3, which depicts a plan view of a portion ofconventional die 100 taken along the line III-III in FIG. 2. As shown,conventional bump-pad 104 is larger than UBM 102 and thus helps absorbmechanical and thermal stress from a corresponding solder bump (notshown in FIG. 3), thereby preventing damage to dielectric material 120and lower layer 116.

Unfortunately, larger bump-pads 104 reduce available area that may beused for routing conductive traces 122 within routing layer 108. Inaddition, some traces need to be long, in order to be routed aroundlarger pads 104. As noted, long traces contribute to increasedresistance and capacitance, which in turn lead to voltage drops alongpower traces, and increased propagation delays across signal traces.Further, integrated circuits formed using process technologies of 45 nmor lower are typically small in size, and often packaged with ELKdielectric materials. Large bump-pads such as bump-pad 104 may not besuitable for such devices.

Accordingly, exemplary embodiments of the present invention may utilizesmaller sized bump-pads suitable for use with ELK dielectric materials.Smaller pad sizes may free up space allowing increased density of powerand ground traces within a give area. Conversely, newly freed up space,permits increased spacing between parallel traces which may decreasecrosstalk. As may be appreciated, reduced cross-talk, and/or increasedpower and ground traces, help improve signal integrity and increaseperformance.

Accordingly, FIG. 4 depicts a vertical cross-section of a semiconductordie 200 exemplary of an embodiment of the present invention. FIG. 5depicts a plan view of the portion of exemplary die 200 in FIG. 4. Asdepicted, exemplary die 200 includes an integrated circuit (IC) formedon a piece of semiconductor wafer (e.g., silicon wafer or GalliumArsenide wafer) and I/O pads 214 interconnected to the IC, which may bemade of, for example, aluminum (Al) or copper (Cu).

Die 200 may also include a routing layer 208 made up of one or morelayers of dielectric material 220, each having a layer of conductivetraces 222A, 222B, 222C (individually and collectively conductive traces222) formed thereon. Die 200 may include a protective cover such aspassivation layer 206, to shield conductive traces 222 from exposure toair, thereby preventing oxidation. Conductive traces 222 mayinterconnect I/O pads 214 to corresponding ones of bump-pads 204.

A plurality of solder bumps 212 may be formed, each on one of bump-pads204. Solder bumps 212 may be used to attach die 200 to a substrate usingflip chip attachment methods. Solder bumps 212 may be aligned tocorresponding bond-pads on the substrate, and reflowed to formelectrical and mechanical bonds. Flip chip attachment methods are wellknown to persons of ordinary skill in the art.

Each conductive trace 222 may connect I/O pad 214 at one end to acorresponding bump-pad 204 (and thus a solder bump 212). Conveniently,bump-pads 204, provide I/O interconnection to the integrated circuit ondie 200.

As may be appreciated, it may be advantageous to design the placement ofI/O pads 214 and associated I/O driver circuitry, free of considerationsof bump-pad placement, so as not to interfere with other optimizations.I/O pads 204 may be area pads, multi-row pads, perimeter pads, or thelike. Regardless of the locations of I/O pads 204, routing layer 208 maybe used to redistribute I/O pads 214 to bump-pads 204 to align solderbumps 212 with respective bond-pads on a substrate.

Conductive traces 222 are typically made of copper or aluminum, but mayalso be made of other metals such as gold, lead, tin, silver, bismuth,antimony, zinc, nickel, zirconium, magnesium, indium, tellurium,gallium, and the like. Alloys of one or more of the above metals mayalso be used.

Under-bump metallization (UBM) 202 may be formed on each of bump-pads204 to provide a low resistance mounting surface to solder bumps 212.For example, in one embodiment, a solder paste may be deposited on eachUBM 202 to form each solder bump 212.

Each UBM 202 may have a top surface 202A in communication with acorresponding solder bump 212 and a bottom contact surface 202B incommunication with a respective bump-pad 204 underneath. UBM 202 mayinclude several sub-layers (not shown) such as an adhesion sub-layer, adiffusion barrier sub-layer, a solder-wettable sub-layer and optionallyan oxidation barrier sub-layer, between its top surface 202A and itsbottom contact surface 202B. Bottom contact surface 202B is in physicalcontact with bump-pad 204.

Formation of UBM 202 may include cleaning, insulating oxide removal, anddepositing metallurgy that makes good electrical and mechanicalconnection to solder bumps 212. The solder wettable sub-layer offers aneasily wettable surface to the molten solder, for good bonding of solderbumps 212 to the underlying bump-pad 204. Solder bumps 212 (like solderbumps 112 of FIG. 2), may be melted using heat, to form electrical andmechanical interconnections between semiconductor die 200 and asubstrate or circuit board.

As will be detailed below, bump-pads 204 of die 200 are smaller thanbump-pads 104 of die 100. Consequently, routing layer 208 provides moreroom or added space for routing conductive traces 222 which may lead toshorter lengths. Shorter traces are advantageous as this leads toreduced trace resistance and capacitance. Reduced resistance andcapacitance values, in turn, lead to reduced voltage drops across powertraces, and smaller signal propagation delays along signal traces.

FIG. 6 depicts a vertical cross section of semiconductor die 200 takenalong line VI-VI in FIG. 5. As depicted in FIG. 6, exemplary bump-pad204 is smaller than its corresponding UBM 202. Exemplary bump-pad 204interconnects I/O pad 214 by way of metal trace 222.

Comparing FIG. 2 with FIG. 4, (or FIG. 3 with FIG. 5), it may beobserved that the smaller bump-pad 204, permits routing a number ofconductive traces 222A, 222B, and 222C (individually and collectivelyconductive traces 222) within about the same area as is occupied bybump-pad 104. The relative sizes of bump-pad 104 and bump-pad 204 arefurther depicted in FIG. 7 and FIG. 9.

Now, to mitigate the effects of stress on the dielectric material inrouting layer 208 that may result from the reduced size for bump-pads204; one or more of traces 222 may be routed near bump-pads 204 in waysthat help absorb mechanical and/or thermo-mechanical stress.

Specifically, in the specific embodiment depicted in FIGS. 4-6,conductive traces 222A, 222B, 222C pass proximate bump-pad 204 tomechanically reinforce routing layer 208 proximate UBM 202. Portions ofconductive traces 222A, 222B, that surround or pass proximate bump-pad204 may be beneath top surface 202A of UBM 202 but not beneath bottomcontact surface 202B in physical contact with bump-pad 204. Conductivetraces 222A, 222B thus reinforce routing layer 208 proximate UBM 202.Portions of conductive traces 222A, 222B passing proximate bump-pad 204may therefore absorb mechanical and/or thermal stress from a solder bumpattached to bump-pad 204, to protect the underlying dielectric material220 proximate solder bump 212.

As depicted in FIG. 5, each of bump-pads 204 may be contained within acircular circumscribing area 224 having a radius R_(area) no shorterthan the mean radius R_(UBM) of the top surface UBM 202A (i.e.,R_(area)≧R_(UBM) where R_(UBM)=D₂/2). As will be detailed later, atleast some of the conductive traces (e.g., traces 222A, 222B) may passthrough circular circumscribing area 224 without directly contacting thebump-pad contained therein to mechanically reinforce routing layer 208proximate the contained bump-pads.

Bump-pad 204 and portions of conductive traces 222A, 222B, 222C insidecircular circumscribing area 224 may be viewed as a “virtual pad”,having an effective size (from a stress absorption standpoint), as largeas a conventional bump-pad 104. Circumscribing area 224 can effectivelybuffer stress from a corresponding solder bump (formed on UBM surface202A on a circumscribed bump-pad 204) thereby protecting the underlyingdielectric material from stress induced damage. Of course in otherembodiments, circular circumscribing area 224 may be the same, larger oreven slightly smaller in size than conventional bump-pad 104.

To compare relative sizes of pads, UBMs and circumscribing areas ofdifferent shapes, the diameter of a circle inscribed within a givenshape may be taken to be representative of the size of the shape.

In FIG. 2, the diameter of a circle inscribed in the top surface 102A ofUBM 102 may be about 80 μm (i.e., d₂≈80 μm). In other words, theinradius of UBM top surface 102A is about 80 μm/2=40 μm. The diameter ofa circle inscribed within bump-pad 104 may be about 92 μm (i.e., d₃≈92μm); and the diameter of a circle inscribed within opening 110 (orwithin bottom contact surface 102B, and denoted d₁) may be about 60 μm(i.e., d₁≈60 μm).

In FIG. 4 however, in one embodiment, the diameter of (a circleinscribed within) top surface 202A of UBM 202 (denoted D₂) may be about80 μm (i.e., D₂≈80 μm). The diameter of (a circle inscribed within)bump-pad 204 may be about 50 μm (i.e., D₃≈50 μm in FIG. 4) and thediameter of (a circle inscribed within) opening 210 (denoted D₁ in FIG.4) may be about 46 μm (i.e., D₁≈46 μm). The width of each conductivetrace 222 (denoted W₁) may be about 12 μm. As will be appreciated bythose skilled in the art, the above figures are only exemplary, andlarger or smaller dimensions may be used in other embodiments.

As well, the shapes UBM surfaces 202A, 202B, bump-pad 204 and opening210 need be neither uniform nor necessarily octagonal. Instead, UBM 202,bump-pad 204 and passivation opening 210 but may take on any shape andmay have varying sizes. They may for example have other polygonalshapes, such as a hexagon or a rectangle. They may also take on othershapes: they may be circular, elliptic, irregular shapes or anyarbitrary shape of suitable size.

The arrangement of conductive traces 222A, 222B, 222C, around orsurrounding bump-pad 204 in exemplary routing layer 208 is advantageous.In addition to permitting an added number of signal routing traces within a given area, the arrangement creates stress buffering zone in theform of circular circumscribing area 224 which may effectively provideas much protection against stress, as the much larger conventionalbump-pad 104. As may be appreciated stress is absorbed by parts ofconductive traces 222A, 222B, 222C proximate bump-pad 204 (in area 224)that could otherwise damage the underlying dielectric material ofrouting layer 208.

FIG. 7 depicts the relative sizes of exemplary bump-pad 204 andconventional bump-pad 104, and exemplary circular circumscribing areasrepresentative of outlines for various stress buffering zones. Area 702corresponds to the difference in surface area between the largerconventional bump-pad 104 and a concentrically located, smallerexemplary bump-pad 204. In conventional bump-pad 104, none of area 702(which forms part of bump-pad 104) can be used for routing.Conveniently, parts of area 702 may be used for routing traces inexemplary embodiments that utilize bump-pads 204.

Conversely however, while all of area 702 helps absorb stress inconventional pads such as bump-pad 104, in exemplary embodiments of thepresent invention only portions of area 702 that are taken up by tracesabsorb stress to reinforce routing layer 208. To increase stressabsorption within area 702, exemplary embodiments may increase thepercentage of area 702 covered by conductive traces.

In exemplary routing layer 208, the stress buffering zone (area ofstress absorption) need not be confined to area 702. It may instead besmaller or larger than area 702. Accordingly, a stress buffering areamay be defined by a first circular circumscribing area 224′ containingbump-pad 204 and portions of traces contained therein. As depicted inFIG. 7, circular circumscribing area 224′ may be smaller in size thanbump-pad 104. However, a stress buffering zone larger than pad 104 maybe formed by using more and more traces that surround bump-pad 204 toreinforce routing layer 208. This is exemplified by a second circularcircumscribing area 224″ depicted in FIG. 7. As may be appreciated,increasing the proportion of surface area of a given circularcircumscribing area (e.g., area 224″) that is covered by a bump-pad andportions of conductive traces contained therein, provides greatermechanical reinforcement for routing layer 208 proximate the containedbump-pad. In some embodiments, the proportion of area 702 that iscovered by conductive traces may be between about 30% and 100%.

FIG. 8 depicts a plan view of an exemplary routing layer 208 of anexemplary semiconductor die 200. Routing layer 208 includes the originalI/O pads 214A, 214B, 214C (individually and collectively I/O pads 214)of the integrated circuit, and redistributed exemplary bump-pads 204A,204B, 204C, 204D (individually and collectively bump-pads 204) suitablefor flip chip solder bump formation. Conductive traces 222D, 222E, 222F,222G, 222H, 222I, 222J, 222K, 222L (individually and collectivelyconductive traces 222), are used to interconnect I/O pads tocorresponding bump-pads (not all shown).

In FIG. 1, only five signal traces are routed between bump-pads 104A and104D. However in FIG. 8, at least ten signal, ground and power traces(i.e. 222D, 222E, 222F, 222G, 222H, 222I, 222J, 222K, 222L, and 222M)can be accommodated between bump-pad 204A and bump-pad 204D. As may beobserved, the routing layer of FIG. 8 includes many more signal tracesbetween bump-pads, without narrowing the spacing separating neighboringtraces, which can promote improved signal density.

In FIG. 8, the depicted conductive pattern for routing layer 208,includes a first conductive trace 222A′ interconnecting a first bump-pad204A for attaching a first solder bump to an I/O pad 214A; and a secondconductive trace 222B′ interconnecting a second bump-pad 204B forattaching a second solder bump, and a second I/O pad 214B. I/O pads 214may have any shape and may be placed anywhere on die 200.

FIG. 9, also depicts a plan view of an exemplary routing layer 208 of anexemplary semiconductor die 200, with outlines of conventionalhypothetical bump-pads 104A′, 104B′, 104C′, 104D′ (individually andcollectively pad outlines 104′) shown to illustrate the relative sizeand routing density achieved by exemplary routing layer 208.

As depicted, portions of conductive trace 222B′, 222C′ (e.g., portionswithin pad outline 104A′) at least partially surround or pass proximatebump-pad 204A. Portions of trace 222A′, 222B′, 222C′ near bump-pad 204Athus absorb stress from a solder bump attached to bump-pad 204A. Thedepicted arrangement effectively forms a “virtual pad” or acircumscribing area (e.g., outline 104A′ or an inscribed circle within)that encloses pad 204A, to protect the dielectric layer proximate pad204A from potential damage caused by thermal and mechanical stress.

FIGS. 8-9 also depict additional pads 204C and 204B each interconnectedto individual respective traces. As depicted, although conductive traces222B′, 222C′ do not directly interconnect bump-pad 204A, portions ofconductive traces 222B′, 222C′ help protect the dielectric layerproximate pad 204A.

Advantageously, costly additional steps are not required to manufacturesemiconductor die 200. For example, one method of manufacturing asemiconductor die such as die 200 may include preparing a wafer that hasat least one integrated circuit (IC) including a set of I/O pads formedon the active surface. A routing layer such as routing layer 208 thatincludes a layer of dielectric material may be formed on the wafer. Therouting layer may have at least one conductive trace formed thereon,interconnecting a first pad (e.g. bump-pad 204), to a first I/O pad. Therouting layer may also include a second bump-pad, a second I/O pad and asecond conductive trace interconnecting the second bump-pad to thesecond I/O pad. The second conductive trace (e.g., trace 222B′) may beformed so as to pass proximate the first bump-pad (e.g., bump-pad 204Ain FIG. 8) and may also partially surround the first bump-pad. Thesecond conductive trace may thus buffer stress from a solder bumpattached to the first bump-pad, to protect the underlying dielectricmaterial proximate the solder bump, from the stress.

A passivation layer may also be formed. The manufacturing method mayfurther involve forming openings on the passivation layer to expose thebump-pads and forming under bump metallization (UBM) pads on eachbump-pad to mount, deposit or attach solder bumps onto the bump-pads.

The method may further involve attaching die 200 onto a carriersubstrate using flip chip attachment. Flip chip attachment is well knownto those of ordinary skill in the art and is discussed for example inHarper, Charles A. 2005, Electronic Packaging and Interconnection, 4thed. New York: McGraw Hill, the contents of which are hereby incorporatedby reference.

Advantageously, routing patterns for traces 222 as depicted in FIGS. 8-9permit increased routing density while still absorbing much of thestress from solder bumps that would otherwise negatively impact theincreasingly brittle dielectric materials used with smaller dice.Smaller bump-pads 204 allow more routing traces 222 for signal,power/ground compared to the larger bump-pads. In addition, smallerbump- pads 204 will be less capacitive for signal transmission.

The effective resistance of power and ground traces can be reduced byincreasing the number of power/ground traces on the routing layer whichadvantageously leads to more efficient power usage. Moreover,semiconductor dice exemplary of embodiments of the present invention,permit bump-pad shapes that need not conform to the shape of UBM padsformed over them.

Conveniently, the described embodiments may avoid costs associated withadding a Polyimide buffer between a UBM and the routing layer.

As may be appreciated, only one layer of dielectric material 220 and onecorresponding layer of conductive traces 222 are depicted in FIGS. 4-5for clarity. However, persons skilled in the art would readilyappreciate that in other embodiments several layers of traces may bearranged insulated from each other by a layer of dielectric materialwithin routing layer 208.

In other embodiments, only some of the bump-pads in routing layer 208 ofdie 200 may be surrounded by a conductive trace passing proximate thebump-pads. There may be some other bump-pads that do not necessarilyhave conductive traces passing near their respective UBM, tomechanically reinforce routing layer 208. There may also be otherbump-pads that are larger than their corresponding UBM (like bump-pad104), in addition to exemplary bump-pads 204 that are smaller than theupper surface of their corresponding UBM.

Embodiments of the present invention may be used in a variety ofapplications including the manufacture of DRAM, SRAM, EEPROM, flashmemory, graphics processors, general purpose processors, DSPs, andvarious standard analog, digital and mixed signal circuit packages.

Of course, the above described embodiments, are intended to beillustrative only and in no way limiting. The described embodiments ofcarrying out the invention, are susceptible to many modifications ofform, arrangement of parts, details and order of operation. Theinvention, rather, is intended to encompass all such modification withinits scope, as defined by the claims.

1. A method of manufacturing a semiconductor die for a die having an integrated circuit (IC) interconnected to a plurality of input-output (I/O) pads, said method comprising: i) forming a plurality of conductive traces on a dielectric layer, said traces interconnecting corresponding ones of a plurality of bump-pads and said I/O pads, at least one of said conductive traces passing proximate one of said bump-pads so as to reinforce said dielectric layer proximate said one of said bump-pads; and ii) attaching a plurality of said solder bumps to corresponding ones of said bump-pads.
 2. The method of claim 2, wherein said attaching said plurality of solder bumps comprises forming under bump metallizations (UBMs) on each of said bump-pads, and mounting each one of said solder bumps onto a corresponding one of said UBMs.
 3. The method of claim 2, further comprising forming a passivation layer over said routing layer.
 4. The method of claim 3, further comprising forming an opening in said passivation layer to expose said bump-pads, to form said UBMs. 